Packaging Integration Engineer

CScale is a startup backed by Sutter Hill Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware. CScale is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true “scale-up” architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures. Duties, Deliverables, and Responsibilities ● Drive Cspeed’s package from initial concept to production ● Help establish photonic and electronic co-design process flow ● Work with OSATs to define integration packaging design rules, process flow, and materials ● Lead optical package development to establish package manufacturability and reliability ● Collaborate with cross-functional teams including silicon photonics, IC design, layout, test and reliability to drive the package/integration forward ● Work with external foundries and OSATs on process integration and packaging for interposer Expertise, Knowledge, and Skills ● Understanding of 2.5D and 3D packaging technologies, i.e. interposers, heterogeneous integration, high-density interconnects ● Ability to select and manage external foundries/OSATs for interposer-based packaging (must understand material selection, state of the art techniques, and advanced process flows required for advanced packaging) ● Must have strong program/project management skills (i.e. set schedule, maintain it, ensure parts arrive on time in the right place, etc.) ● Clear communication, ability to work cross-functionally and interface with design, SI/PI, testing, vendors, OSATs, etc ● Bonus: Familiarity with layout design for high-speed applications, simulation, mechanical and thermal analysis Experience, Background, and Accomplishments ● Driven multiple 2.5D/3D high-speed packages end to end, working with all roles on the packaging team (design, layout, SI/PI, test and reliability, etc.) ● Experience driving packages with unconventional needs / uncommon processes ● Experience working with large, established OSATs and foundries on custom processes and flows ● B.Sc.+ in EE or Materials or Optics